Wood chipboard: recommendations for use = Panneau de particules: recommandations d'emploiDINWOODIE, J. M.1985, Num 1P-3, 4 p.Article

Dimensional instability of cement bonded particleboard : SEM and image analysisFAN, M. Z; BONFIELD, P. W; DINWOODIE, J. M et al.Journal of materials science. 2000, Vol 35, Num 24, pp 6213-6220, issn 0022-2461Article

Modelling the creep behaviour of chipboard : The rheological approachMUNDY, J. S; BONFIELD, P. W; DINWOODIE, J. M et al.Wood science and technology (Print). 1998, Vol 32, Num 4, pp 261-272, issn 0043-7719Article

Dimensional instability of cement-bonded particleboard : Behavior of cement paste and its contribution to the compositeMIZI FAN; DINWOODIE, J. M; BONFIELD, P. W et al.Wood and fiber science. 1999, Vol 31, Num 3, pp 306-318, issn 0735-6161Article

The physical properties of boards treated with vapor boronHASHIM, R; MURPHY, R. J; DICKINSON, D. J et al.Forest products journal. 1997, Vol 47, Num 1, pp 61-66, issn 0015-7473Article

Fatigue and creep in chipboard. Part 3. The effect of frequencyTHOMPSON, R. J. H; BONFIELD, P. W; DINWOODIE, J. M et al.Wood science and technology (Print). 1996, Vol 30, Num 5, pp 293-305, issn 0043-7719Article

Creep in chipboard. VI: Time to failure analysis under steady state conditionsPIERCE, C. B; DINWOODIE, J. M; PAXTON, B. H et al.Wood science and technology (Print). 1986, Vol 20, Num 3, pp 281-292, issn 0043-7719Article

Dimensional instability of cement bonded particleboard : behaviour of wood chips from various stages of manufacture of CBPBFAN, M. Z; DINWOODIE, J. M; BONFIELD, P. W et al.Journal of materials science. 1999, Vol 34, Num 8, pp 1729-1740, issn 0022-2461Article

Fatigue and creep of chipboard. I: Fatigue at R=0.01BONFIELD, P. W; HACKER, C. L; ANSELL, M. P et al.Wood science and technology (Print). 1994, Vol 28, Num 6, pp 423-435, issn 0043-7719Article

Creep in chipboard. II : The effect of cyclic changes in moisture content and temperature on the creep behaviour of a range of boards at different levels of stressingDINWOODIE, J. M; HIGGINS, J.-A; PAXTON, B. H et al.Wood science and technology (Print). 1992, Vol 26, Num 6, pp 429-448, issn 0043-7719Article

Creep research on particleboard: 15 year's work at the UK building research establishmentDINWOODIE, J. M; HIGGINS, J.-A; PAXTON, B. H et al.Holz als Roh- und Werkstoff. 1990, Vol 48, Num 1, pp 5-10, issn 0018-3768Article

Dimensional instability of cement bonded particleboard. Part 2: Behaviour and its prediction under cyclic changes in RHFAN, M. Z; DINWOODIE, J. M; BONFIELD, P. W et al.Wood science and technology (Print). 2004, Vol 38, Num 1, pp 53-68, issn 0043-7719, 16 p.Article

Dimensional instability of cement bonded particleboard. Part 1: Behaviour and modelling prediction under a constant and single change in RHFAN, M. Z; DINWOODIE, J. M; BONFIELD, P. W et al.Wood science and technology (Print). 2002, Vol 36, Num 2, pp 125-143, issn 0043-7719Article

Fatigue in wood-based panels. Part 1: The strength variability and fatigue performance of OSB, chipboard and MDFTHOMPSON, R. J. H; ANSELL, M. P; BONFIELD, P. W et al.Wood science and technology (Print). 2002, Vol 36, Num 3, pp 255-269, issn 0043-7719Article

Dimensional instability of cement-bonded particleboard : Mechanisms of deformation of CBPBFAN, M. Z; BONFIELD, P. W; DINWOODIE, J. M et al.Cement and concrete research. 1999, Vol 29, Num 6, pp 923-932, issn 0008-8846Article

Fatigue and creep in chipboard. II: The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contentsDINWOODIE, J. M; PAXTON, B. H; BONFIELD, P. W et al.Wood science and technology (Print). 1995, Vol 29, Num 1, pp 64-76, issn 0043-7719Article

The mechanical properties of boards treated with vapor boronHASHIM, R; MURPHY, R. J; DICKINSON, D. J et al.Forest products journal. 1994, Vol 44, Num 10, pp 73-79, issn 0015-7473Article

Creep in chipboard. VIII, The effect of steady-state moisture content, temperature and level of stressing on the relative creep behaviour and creep modulus of a range of boardsDINWOODIE, J. M; ROBSON, D. J; PAXTON, B. H et al.Wood science and technology (Print). 1991, Vol 25, Num 3, pp 225-238, issn 0043-7719, 14 p.Article

Creep in chipboard. XX : The effect of variable climate on the creep behaviour of a range of chipboards and one waferboardDINWOODIE, J. M; PAXTON, B. H; HIGGINS, J. S et al.Wood science and technology (Print). 1991, Vol 26, Num 1, pp 39-51, issn 0043-7719Article

Creep in chipboard. VII, Testing the efficacy of models on 7―10 years data and evaluating optimum period of predictionDINWOODIE, J. M. W; HIGGINS, J.-A; ROBSON, D. J et al.Wood science and technology (Print). 1990, Vol 24, Num 2, pp 181-189, issn 0043-7719Article